However, full silicon interposers are expensive. They require "through-silicon vias" (TSVs), which are like drilling microscopic elevators through the silicon.
For the i9-10980XE, the interposer facilitated a ring bus that stretched across 18 cores and the I/O die. Without EMIB, that ring bus would have collapsed due to signal skew over a long organic package.
Interposer I9 __top__ Site
However, full silicon interposers are expensive. They require "through-silicon vias" (TSVs), which are like drilling microscopic elevators through the silicon.
For the i9-10980XE, the interposer facilitated a ring bus that stretched across 18 cores and the I/O die. Without EMIB, that ring bus would have collapsed due to signal skew over a long organic package. interposer i9